Connect.Everything
Abstract
The Connect.Everything program will focus on the fielding of low-power, intelligent communication modules with high functionality density to enable ubiquitous connectivity. Research efforts will focus on leveraging commercial industry investment in future wireless technology to develop communication modules that operate within the various unlicensed radio frequency (RF) and millimeter wave (mm-wave) frequency bands. Employing advanced silicon technology, a fully-integrated multi-channel transceiver array including antenna, RF front-end amplifiers, passives, modems, and digital processors will be realized with a goal of reducing the barrier of connecting an existing device into a high data rate network. These universal communication modules will be capable of accepting digital input data and DC power only, modulating the digital data and generating RF/mm-wave radio signals, and receiving and demodulating external RF/mm-wave radio signals into digital output data. More importantly, built-in calibration, tuning, and self-test functions will be integrated so that the communication module will not require costly post-manufacture testing and evaluation. The program will extend current state of art Multiple-Input Multiple-Output (MIMO) techniques toward future applications which require gigahertz bandwidth, low latency, low power, and high power efficiency to support seamless connectivity between users, sensors, payloads, and platforms across the RF and mm-wave spectrum.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2017
- Source ID
- 2e0ee0f44ad11fae11d6f294eeabdc76
Related Documents
- Root: ELECTRONICS TECHNOLOGY