Improved Capabilities SPY-1 Radar

Abstract

Improved Capabilities for SPY-1 Radar: These Reliability, Maintainability, and Availability (RM&A) improvements and solid state technology insertions are intended to reduce cascading failures, mitigate obsolescence issues, and improve reliability in support of Anti-Air Warfare (AAW) and Ballistic Missile Defense (BMD) missions while still providing AN/ SPY-1 Radar Total Ownership Cost Reductions. Improvements, such as Solid State Insertion to address Diminishing Manufacturing Sources and Material Shortages (DMSMS), will yield reductions in annual fleet maintenance costs and is a top fleet requirement as part of the AEGIS Wholeness initiative. In addition to RM&A improvements, warfighting improvements funded in this line include: Transmitter Noise Cancellation (TNC) development will include hardware/software to counter low radar cross section, low altitude threats. Side Lobe Blanking (SLB) addresses shortfalls in mixed electronic attack environment while in an Integrated Air and Missile Defense (IAMD) mode. The Ship-Based Non-Cooperative Target Recognition (SBNCTR) program Phases 2, 2A and 3 will develop algorithms to provide classification for targets. Transition of Advanced Calibration Experiment (ACE) Phases 1 and 2 from Baseline 7 into Baseline 9. Incorporate ERACE Phases 1/2 and 3 into Baseline 9. Electronic Attack (EA) and Rapid Radar Capability Improvement Program (R2CIP) develop solutions for evolving EA threats. Due to funding reductions since FY 2021, some efforts have shifted to a later FY across the FYDP. FY 2022 funding includes start of ACE Phase 2, and the continuation of development efforts of SBNCTR Phase 2A, TNC phase 1 & 2, EA improvements, Solid State Insertion and Elevated Radar Advanced Calibration Experiment (ERACE) Phase 1/2.

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Document Details

Document Type
Project
Publication Date
Oct 01, 2022
Source ID
3301_0604501N_5_1319_PB_2022

Tags

Readers

  • Naval Mine Countermeasure Systems Development.
  • Radar Systems Engineering.

Technology Areas

  • Microelectronics

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