SEWIP Block 3
Abstract
SEWIP Block 3 is developing an advanced Electronic Attack (EA) capability to keep pace with the evolving Anti-Ship Missile (ASM) threat and counter-targeting required for the AN/SLQ-32(V) system. SEWIP Block 3 will provide the AN/SLQ-32(V)7 system for all surface ships (CVN, DDG, LHD) outfitted with the active variant of the AN/SLQ-32, mainly the (V)3 and (V)4, as well as select new construction platforms. The SEWIP Block 3 Acquisition leverages technology developed under the Office of Naval Research's (ONR) Integrated Topside (InTop) Science and Technology (S&T) effort. SEWIP Block 3 will continue to expand the integrated shipboard combat system by providing new integrated EA transmitters, arrays, and associated EA techniques. The AN/SLQ-32(V)7 integrates the new EA countermeasure (SEWIP Block 3) with the AN/SLQ-32(V)6. The AN/SLQ-32(V)6 includes an Electronic Support (ES) receiver (SEWIP Block 2), a High Gain High Sensitivity (HGHS) receiver (SEWIP Block 1B3), a Specific Emitter Identifier (SEI) receiver (SEWIP Block 1B2), display console, and backend electronics. SEWIP Block 3 includes the government software development and integration effort for a SoftKill Coordinator (SKC) to manage EA engagements. SEWIP Block 3 is developing an Electronic Warfare Test Bed (EWTB) to validate system performance via modeling and simulation. SEWIP Block 3 is also investigating higher efficiency Gallium Nitride (GaN) High Power Amplifiers (HPA). GaN HPAs are used in maritime advanced technology radar and surface electronic warfare systems. For radar and electronic warfare systems, this will yield technology to incorporate and integrate into radar and electronic warfare Transmit/Receive Module designs, with a beneficial impact of improved Power Added Efficiency (PAE) for the systems resulting in a reduction in power draw from ship's service electrical power for the same radar and electronic warfare system performance. To keep pace with evolving ASM threats and counter-targeting, SEWIP Block 3 will incorporate capability improvements via a technology insertion plan. This capability improvement plan will mature, develop, and validate technology solutions to improve capability for insertion into SEWIP Block 3 upgrades. Technology solutions will result in technical data packages with Government-owned data rights. Solutions will be incorporated into the SEWIP Block 3 technical data packages for incorporation into production and/or back-fit of fielded systems. The FY25 funding request for SEWIP Block 3 will focus on the conduct of Technical Evaluation (TECHEVAL)/Initial Operational Test & Evaluation (IOT&E) and the Full Rate Production (FRP) Decision Review (DR). Software and Hardware baseline upgrades, training curriculum development and EW Testbed model upgrades will continue. HPA efficiency design and development efforts to reduce required power and fuel consumption will conclude. Block 3 Capability Improvements will commence in FY25.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2025
- Source ID
- 3321_0604757N_5_1319_PB_2025
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