SBIR Accomplishments/Plans
Abstract
DLA FY 2023 SBIR/STTR Accomplishments: - Grew Small Business capability to combat repair part sourcing challenges associated with weapon system aging, obsolescence, and DMSMS through innovation, reverse engineering, and advanced manufacturing techniques - Developed domestic suppliers for critical REEs, and derived materials and parts, such as magnets. Successfully developed recycling technologies for rare earth elements/magnets and qualified products for a drop-in replacement for high performance weapons systems (i.e., F-35s/F-16s, JDAMs, turbine engines for various fighter jets, etc.) - Sponsored innovative manufacturing technologies to enhance supply chain operation and improve weapon system lifecycle performance (i.e., Fuel Cells, A/C Canopy Seals, Braking Systems, etc.) - Developed Additive Manufacturing process monitoring and control system for Laser Powder Bed Fusion and Directed Energy Deposition methods - Transition system to OEMs, Army ARL, Air Force, NASA, and other research institutions. DMEA FY 2023 SBIR/STTR Accomplishments: DMEA FY23 SBIR Accomplishments - The SBIR Program contributed to the advancement of microelectronics concepts, technologies, and applications through the following topics initiated in FY23: •Automated Measurement of Passive Devices in Printed Circuit Assemblies (SBIR PI - one award) •High Voltage Package Encapsulation using Innovative and Advanced Materials (SBIR PI - two awards) •High-G Accelerometers (SBIR PI - two awards) •High-G Clock Source (SBIR PI - two awards) •Low Cost High Power Opening and Closing Switches (DP2 - one award) •Modular Cryogenic Dewar for Radiation Testing (SBIR PI - one award) •Ultra-High Voltage Insulated Gate Bipolar Transistor on SiC (DP2 - one award) •Ultra Wideband Voltage Controlled Oscillator (SBIR PI - two awards) •Vertical Photoconductive Semiconductor Switch (PCSS) & Triggering Assembly (SBIR PI - two awards) •Synthesizable Register Transfer Logic Assertions (FY22 Phase II) •Radiation Shielding (MDA Sequential Phase II (SP2)) •BlockChain Supply Chain Enhancement for Trusted and Assured FPGAs and ASICs (PII Enhancement) DMEA has one FY23 STTR PI Open Topic to report: Applications to Assist in Analysis and Re-Engineering of Printed Circuit Board Assemblies. Award(s) will be made in FY24.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2025
- Source ID
- 34f2cddbaa61835885968f8a0dc0aec3