Advanced Electronics Manufacturing - Sensor Hardening
Abstract
The F-35 Joint Strike Fighter (JSF) has the requirement to minimize low and high powered laser effects on mission accomplishment. Current F-35 Electro-Optical Targeting System (EOTS) and Electro-Optical Distributed Aperture System (EODAS) focal plane arrays (FPAs) suffer manufacturing yield and cost issues. This effort will leverage prior and concurrent DoD investments in laser protection technology to make manufacturing improvements that incorporate laser protection technology into the FPA’s Read-Out Integrated Circuits (ROICs) while concurrently reducing ROIC defects (improving yield) and minimizing the total cost to F-35 to meet this requirement. The goal is to increase the Transition Readiness Level/Manufacturing Readiness Level to TRL/MRL 6 (demonstrate/produce prototype system or subsystem in a relevant environment) and to transition laser-hardened FPAs in time for the F-35 Block 5 Upgrade. These technologies are applicable not just for F-35, but to any Medium Wavelength Infrared detector, including those on tactical and reconnaissance sensor systems.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2014
- Source ID
- 3a33e4a2cb1bb0959185fe8b60ee9b91