Next Generation Microelectronics Manufacturing (NGMM)
Abstract
The Next Generation Microelectronics Manufacturing program is creating a domestic capability for next-generation microsystems using three-dimensional heterogeneous integration (3DHI), including design, fabrication, packaging, assembly, and testing. This capability will emphasize design innovations to sustain U.S. leadership in semiconductors and enhance the use of manufacturing automation in the design, assembly, and testing of 3DHI test articles. The baseline capability will allow users from across the country to quickly and efficiently develop working test articles based on early-stage research and development. This will enable a wide range of organizations and stakeholders to accelerate a domestic 3DHI ecosystem, in the same way foundry access enabled fabless design companies and their associated ecosystems to proliferate. This research service will feature a baseline fabrication capability for research test articles via a stable 3DHI assembly design kit. Users of the research service will have the ability to join multi-project demonstration runs or dedicated taxi runs. This national accelerator will remove a major impediment to the domestic development of next-generation three-dimensional microsystems and will extend research capabilities beyond those currently being developed worldwide. The research services will incorporate the ability to fabricate unique microsystem test articles using a wide range of devices and materials, integrating the most advanced manufacturing and assembly technologies across silicon, compound semiconductors, photonics, MEMS, and other advanced microelectronics technologies. Applied research associated with this effort is funded within PE 0602716E, Project ELT-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2025
- Source ID
- 3b18d853e5625203ffa63b9fe39846f3