Chip-to-Chip Optical Interconnects (C2OI)
Abstract
The performance of electronic interconnect technologies, particularly for implementing high-speed communications channels on printed circuit boards and back planes, is currently being outpaced by the ever-advancing needs of complementary metal-oxide semiconductor (CMOS) microprocessor chips. This performance gap in the on-chip and between chip interconnection technology will create substantial data throughput bottlenecks, deleteriously affecting future military-critical sensor signal processing systems. To address this pressing issue, the Chip-to-Chip Optical Interconnects (C2OI) program developed optical technology for implementing chip-to-chip interconnects at the board and backplane level.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2013
- Source ID
- 3dd983b0b32c51b0873de4fecee01b50
Related Documents
- Root: ELECTRONICS TECHNOLOGY