Minitherms3D

Abstract

Minitherms3D is developing thermal management solutions for the three-dimensional heterogeneous integration (3DHI) of microelectronics to accelerate the growth of compact, high-performance microsystems. 3DHI microsystems are enabling technologies for phased array systems and dense computing for artificial intelligence and machine learning applications. Minitherms3D will reduce the size, weight and power (SWaP) of high-performance 3DHI microsystems by developing novel methods to remove heat from within the 3D stack, transmit it to the outer boundaries of the stack, and reject it to outside the ambient environment.

Document Details

Document Type
Accomplishment
Publication Date
Oct 01, 2025
Source ID
4096f068f5bd71a0ae7883c06eb10369

Tags

Readers

  • Electrical Engineering
  • Fluid Dynamics.
  • Integrated Circuit Design and Technology.

Technology Areas

  • AI & ML
  • AI & ML - DoD AI Strategy
  • Microelectronics
  • Microelectronics - Graphene

Related Documents