Next Generation Microelectronics - Advanced Manufacturing for Extreme Environment Electronics

Abstract

Next Generation Microelectronics - Advanced Manufacturing for Extreme Environment Electronics addresses the design, fabrication, packaging, assembly, and testing of the next generation of microsystems targeted for use in extreme environments: high voltage, high current, high temperature, low temperature, and radiation exposure. New manufacturing methods will be created, with an emphasis on developing techniques to enable high survivability of these microsystems while operating in the extreme environments. This effort will also develop techniques to significantly improve the performance of these unique microsystems. Basic research related to this effort is funded within PE 0601101E, Project ES-02.

Document Details

Document Type
Accomplishment
Publication Date
Oct 01, 2025
Source ID
42cd37ce8fd3756f3359540aaee450a9

Tags

Fields of Study

  • Engineering
  • Physics

Readers

  • Climatology
  • Integrated Circuit Design and Technology.
  • Military Science and Technology Research and Modernization.

Technology Areas

  • Microelectronics

Related Documents