Electronic Globalization
Abstract
Approximately 66% of all installed semiconductor wafer capacity is in Asia. This creates a significant risk for the DoD as off-shore manufacturing of microelectronic components could introduce various vulnerabilities to DoD systems that utilize these non-U.S. fabricated electronic components. As the DoD is faced with this globalization reality, it is essential to prevent potential consequences such as reverse engineering, theft of U.S. intellectual property, and non-authorized use of these electronic components in adversary defense systems. New applied research technology enablement will be developed in the Electronics Globalization program to provide the desired responses such as special chip packaging, on-board infrastructures, process modifications, and the use of Supply Chain Hardware Intercepts for Electronics Defense (SHIELD)-monitor dielet. Applied research will focus on the engineering of unique devices and circuit technologies. Concepts and design flows which enable trust in an untrusted environment will be developed and applied. Basic research for the program is budgeted in PE 0601101E, Project ES-01.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2016
- Source ID
- 481090a94d5368681e7682d122987a5f