Next Generation Microelectronics - Advanced Manufacturing Tools
Abstract
Next Generation Microelectronics - Advanced Manufacturing Tools addresses the development of new manufacturing tools for the design, fabrication, packaging, assembly, testing, and digital emulation of the next generation of advanced microsystems. Specifically, these advanced microsystems include three-dimensional heterogeneous integration (3DHI) and designs targeted for use in extreme environments such as high voltage, high current, high temperature, low temperature, and radiation exposure. New tools to improve manufacturing and testing will be designed, built, and characterized. These tools will enable cost-effective on-shoring of automated processes for packaging, assembly, and testing of advanced microsystems. The software and hardware tools addressed in this program will advance integration techniques beyond current commercial capabilities to support national security needs. Design, verification, and security for 3DHI will be supported by coordinated investments that couple manufacturing and electronic design automation. Basic research related to this effort is funded within PE 0601101E, Project ES-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2024
- Source ID
- 4be22be276b25a715e4dfcc0fb880f96
Related Documents
- Root: ELECTRONICS TECHNOLOGY