Next Generation Microelectronics - Advanced Manufacturing Approaches for three-dimensional heterogeneous integration (3DHI)
Abstract
Next Generation Microelectronics - Advanced Manufacturing Approaches for three-dimensional heterogeneous integration (3DHI) addresses the unique manufacturing requirements for 3DHI microsystems, including design, fabrication, packaging, assembly, testing, and digital emulation. These new manufacturing methods will feature increasing circuit-scale interconnect densities for integration, and enhancing the security and interoperability of these complex designs. New multi-chip, multi-technology assembly and packaging will advance beyond silicon-centric integration to include integration of radio frequency (RF), photonics, novel memory, and compound semiconductors. In order to enable this diversity of materials and functions, integration technologies will be enabled by improving thermal management, improving inter-chip power delivery, and improving the modeling and simulation of these new systems on chip. Basic research related to this effort is funded within PE 0601101E, Project ES-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2024
- Source ID
- 4e04b4c5b5c13c00d7da99b10ba219e0
Related Documents
- Root: ELECTRONICS TECHNOLOGY