Dense Electronic Packaging for Heterogeneous Integration (DELPHI)
Abstract
The Dense Electronic Packaging for Heterogeneous Integration (DELPHI) program will address the inherent limits of conventional two-dimensional (2D) electronics. Typically, electronics consisted of either single materials such as silicon or of compound semiconductors such as gallium arsenide (GaAs), indium phosphide (InP) or gallium nitride and featured device and circuit architectures in 2D. However, recent developments in the heterogenous integration of different materials systems and advancements in 3D fabrication establish the path to achieving electronic devices and circuits with dramatic increases in performance. This program will harness these advancements and expand on them by developing new semiconductor interconnect materials, heterogeneous integration approaches, and 3D fabrication techniques for advanced devices and circuits. This program will also create robust, compact, low loss passive components and combining networks necessary to realize efficient power amplifiers with heterogeneous integration. The technologies developed will support transitions including enabling emerging satellite communication and sensing missions to provide enhanced situational awareness.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2022
- Source ID
- 4edd1250e17bde27dcb9fd7f87df109f