Access to Advanced Packaging and Testing - Development
Abstract
This project will utilize specialized DoD chiplets (small specialized die) in a heterogeneous integrated (HI) assembly, allowing the DoD to accelerate adoption of the most advanced microelectronics available. Working with world-class industrial partners will provide early access to proprietary information related to these technologies, giving DoD an asymmetrical advantage.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2021
- Source ID
- 60850792b85433becd8b1bbc9324f17f