Beyond Scaling - Materials
Abstract
The Beyond Scaling - Materials program is demonstrating the integration of novel materials into next-generation logic and memory components. This program is pursuing potential enhancements in electronics that do not rely on Moore's Law, i.e. silicon scaling, including research into new materials and the implications of those materials at the device, algorithm, and packaging levels. Research areas include heterogeneous integration of multiple materials, "sticky logic" and novel transistor devices that combine elements of computation and memory, and leveraging three-dimensional vertical circuit integration to demonstrate dramatic performance improvements with older silicon technologies. Further research supports innovation in the technology cycle by working with entrepreneurs focused on DoD-relevant businesses. Basic research for this program is funded within PE 0601101E, Project ES-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2022
- Source ID
- 64e988a788a14b291811374e62731543
Related Documents
- Root: ELECTRONICS TECHNOLOGY