Beyond Scaling - Materials
Abstract
The Beyond Scaling - Materials program is demonstrating the integration of novel materials into next-generation logic and memory components. Historically, the DoD had taken the lead in shaping the electronics field through research in semiconductor materials, circuits, and processors. However, as DoD focuses on military-specific components and commercial investments eschew the semiconductor space, U.S. fundamental electronics research is stagnant just as an inflection point in Moore's Law (silicon scaling) is about to occur. This program is pursuing potential enhancements in electronics that do not rely on Moore's Law, including research not only into new materials but also into the implications of those materials at the device, algorithm, and packaging levels. Research areas include heterogeneous integration of multiple materials, "sticky logic" devices that combine elements of computation and memory, and leveraging three-dimensional vertical circuit integration to demonstrate dramatic performance improvements with older silicon technologies. Further research will support innovation in the technology cycle by working with entrepreneurs focused on DoD-relevant businesses. The program is demonstrating the manufacturability of functioning switches, memory, and novel computational units in a large-scale system. Previous DARPA work on unconventional computing, integration, and reprogrammable memory give confidence in this approach. Basic research for this program is funded within PE 0601101E, Project ES-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2021
- Source ID
- 66802f31c39b062169a11bc2b068a92c
Related Documents
- Root: ELECTRONICS TECHNOLOGY