Next Generation Microelectronics - Advanced Manufacturing Science
Abstract
Next Generation Microelectronics - Advanced Manufacturing Science addresses the fundamental science of advanced design, fabrication, packaging, assembly, and testing for complex microsystems. This area also addresses leveraging the underlying device physics of novel material systems to enable electronics that operate in extreme environments, such as environments with high voltage, high current, high temperature, low temperature, and radiation exposure. This effort will build upon a fundamental understanding of the materials, interconnects, and device technologies to enable the design, assembly, testing, and digital emulation of three-dimensional heterogeneous integration (3DHI) in microsystems, and their use in both standard and extreme environments. The physics of interfaces between similar and dissimilar materials and the ability to characterize and reduce defect densities will be critical to the future of 3DHI approaches. In addition, the physics of electron transport, photon transport, and heat dissipation are key areas of study. Materials advances and metrology that improve the reliability of heterogeneously integrated microsystems will be addressed, including those that enable high current density for power delivery. Applied research related to this effort is funded within PE 0602716E, Project ELT-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2023
- Source ID
- 68b005e714938aa0d219048221a5d170