Next Generation Microelectronics - Advanced Manufacturing Approaches for three-dimensional heterogeneous integration (3DHI)
Abstract
Next Generation Microelectronics - Advanced Manufacturing Approaches for three-dimensional heterogeneous integration (3DHI) addresses the unique manufacturing requirements for 3DHI microsystems, including design, fabrication, packaging, assembly, and security. New multi-chip, multi-technology assembly and packaging will advance beyond silicon-centric integration to include integration of radio frequency (RF), photonics, and compound semiconductors. In order to enable this diversity of materials and functions, integration technologies will be enabled by improving thermal management, improving inter-chip power delivery, and improving the diagnostic capability of these complex microstructures. Basic research related to this effort is funded within PE 0601101E, Project ES-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2025
- Source ID
- 70bf93cdfe1cbe6dace763dfb3a0e373
Related Documents
- Root: ELECTRONICS TECHNOLOGY