Next Generation Microelectronics Prototyping - Public-Private Partnerships
Abstract
Next Generation Microelectronics Prototyping - Public-Private Partnerships plans, establishes, and supports public-private partnerships to manufacture next-generation microsystems using three-dimensional heterogeneous integration (3DHI), including design, fabrication, packaging, assembly, and testing. This capability, a National Network for Next Generation Microelectronics Manufacturing, will emphasize design innovations to sustain U.S. leadership in semiconductors and enhance the use of manufacturing automation in the design, assembly, and testing of 3DHI prototypes. The baseline capability will allow users from across the country to quickly and efficiently develop working prototypes based on early-stage R&D. This will enable a wide range of organizations and stakeholders to accelerate a domestic 3DHI ecosystem, similar to how foundry access enabled fabless design companies and their associated ecosystems to proliferate. This research service will feature a baseline fabrication capability for research prototypes via a stable 3DHI process design kit. Users of the research service will have the ability to join multi-project demonstrations runs or dedicated taxi runs. This national accelerator will remove a major impediment to the domestic development of next-generation three-dimensional microsystems and will extend research capabilities beyond those currently being developed worldwide. The research services will incorporate the ability to fabricate unique microsystem prototypes using a wide range of devices and materials, integrating the most advanced manufacturing and assembly technologies across silicon, compound semiconductors, photonics, MEMS, and other advanced microelectronics technologies. Applied research related to this effort is funded within PE 0602716E, Project ELT-02.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2023
- Source ID
- 76a74ce6122f887a1b1a1f918ac41fa3