Power Electronic Components and Materials
Abstract
This effort investigates and develops electric conversion technologies to reduce size and weight while increasing performance and capabilities to support current and future mission loads and provide improved military vehicle mobility. Research focuses on semiconductor power switches, power switch modules and packaging, and power switch module thermal management. Investigation high voltage/high frequency power semiconductor materials and devices concentrates on efficient power switching under militarily relevant temperature ranges. Development of multi-disciplinary parametric design optimization software tools and multi-functional package structures provides advances in device packaging technology to fully realize device performance improvements. Results of the research will inform the Novel Propulsion Research effort in PE 0602145A (Next Generation Combat Vehicle Technology) / BH5 (Platform Electrification and Mobility Technology).
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2021
- Source ID
- 8a3dc58d82e847772dba8ee13a39828e