Diverse & Accessible Heterogeneous Integration (DAHI)
Abstract
The Diverse Accessible Heterogeneous Integration (DAHI) program is developing the design and manufacturing capabilities required to seamlessly integrate various semiconductors, microelectromechanical systems, photonic (light-manipulating) devices, and thermal management structures into true systems-on-a-chip (SOC). This capability would enable dramatic size, weight, and volume reductions and higher performance for DoD electronic warfare, communications, and radar systems. Historically, chip designers have had to decide between the availability, development, and low cost of silicon circuits or the high performance of compound semiconductor (CS) materials. DAHI, however, builds on previous DARPA and commercial efforts, which demonstrated that heterogeneously integrating CS and silicon can yield significant performance improvements over silicon or CS alone. DAHI's applied research program focuses on developing and demonstrating high-performance SOC for DoD-specific applications. The program should also enhance the manufacturing yield and reliability of heterogeneous integration capabilities and demonstrate innovative, advanced microsystems that leverage heterogeneous integration. Relevant manufacturing processes would be made available to a wide variety of designers from the DoD laboratories, federally funded research and development centers, academia, and industry. This program has advanced technology development efforts funded in PE 0603739E, Project MT-15.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2018
- Source ID
- 8c3d9b941a72a3e7f3489a2c072a19c0
Related Documents
- Root: ELECTRONICS TECHNOLOGY