Wafer-scale Infrared Detectors (WIRED)*
Abstract
*Formerly Microwaves and Magnetics (M&M) Leveraging investments in high-volume wafer scale processing has made digital imaging technologies ubiquitous, for example, making high resolution digital cameras common place in every cell phone. A smaller scale revolution is currently underway due to the development of long-wave infrared (LWIR) thermal imaging sensors. These sensors are also manufactured at the wafer scale, and they are becoming widely available due to the low cost relative to existing infrared (IR) imaging technologies. No similar technology exists in the tactically and strategically important short-wave and mid-wave IR (SWIR/MWIR) bands. The Wafer-scale Infrared Detectors (WIRED) program addresses these needs by developing high performance SWIR and MWIR Focal Plane Array (FPA) technologies that are manufactured at the wafer scale. These sensors will provide increased standoff distances to smaller Tier I and II class unmanned aerial vehicle platforms, low cost missiles, hand held weapon sights/handheld surveillance systems, helmet-mounted systems, and ground vehicle-mounted threat warning systems. The MWIR detector technologies developed under WIRED will provide, for the first time, MWIR FPAs that do not require heavy, expensive cryogenic coolers. The SWIR detector technologies will provide, for the first time, diffraction limited imaging with compact optics. Significant challenges include obtaining high detector performance from disordered materials that can be deposited directly onto readout integrated circuits (ROICs). New ROIC designs will also be required to achieve the noise reduction and pixel pitches required for the suggested applications.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2017
- Source ID
- 8cf0793e3a60d9b1a6780784fe9463db
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- Root: ELECTRONICS TECHNOLOGY