Access to Advanced Packaging and Testing - Demonstration
Abstract
This project will deliver an on-shore SHIP assembly and test capability. It will provide access to, personalization of, and customization for supporting DoD programs. It will enable a revolutionary leap in system performance that will greatly reduce size, weight and power (SWaP) by incorporating the immense advances in SOTA commercial off the shelf (COTS) processing technologies, such as field programmable gate arrays (FPGAs), microprocessors, and Graphic Processing Units (GPUs).
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2022
- Source ID
- 931d5daa4425acb1dcaca8e3be81b10a