Low Cost Thermal Imager - Manufacturing (LCTI-M)
Abstract
The Low Cost Thermal Imager - Manufacturing (LCTI-M) effort builds upon previous manufacturing and imaging work and will develop a pocket-sized, manufacturable, and practical thermal imager at a price point that allows them to be provided to large numbers of warfighters. Availability of very low cost and small form-factor infrared (IR) cameras will facilitate new techniques and applications that could provide the decisive edge needed in modern battlefields. These cameras will allow a soldier to have practical thermal imaging capability for locating warm objects (e.g., enemy combatants) in darkness. The small size, weight and power (SWaP) thermal camera will be integrated with a handheld device such as a cell phone with network capability for tactical intelligence, surveillance and reconnaissance. In order to achieve this goal, breakthroughs will be required in low-cost thermal imagers manufactured using wafer scale integration, vacuum packaging, low cost optics and low-power signal processing. By the end of the program, the imager chips will be fully integrated with a low-cost processor and optics. The camera will have wireless connectivity to integrate video display with cell phones or PDAs. U.S. Army PEO Soldier Sensors and Lasers (SSL), PM Optics USMC and industry will be the transition partners.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2013
- Source ID
- 96996af6ba042b820c0fc4186e1ff059