THE EFFECT OF DISPERSIONS ON THE CREEP PROPERTIES OF ALUMINUM-COPPER ALLOYS

Abstract

The creep properties of Al-Cu alloys containing dispersions of CuAl sub 2 in the alpha solid-solution matrix of Al were primarily dependent on the volumetric mean free path () between the CuAl sub 2 particles and independent of minor variations in composition (3 to 5% Cu) and heat treatment. The creep stress correlated with the creep rate-temperature parameter Z = epsilon sub s sub e delta H/RT, where sub s is the secondary creep rate, delta H the activation energy, R the gas constant, and T the absolute temperature during creep. Above ln Z = 46 and below ln Z = 27.5, the finer dispersions exhibited superior creep resistance; in the intervening range, the coarser dispersions were superior. CuAl sub 2 dispersions increased the Al creep resistance above that obtained by alloying with Cu. delta H was a constant of about 37,000 cal/ mol. Constant-load creep strains for dispersion alloys appeared to be functions of the initial stress and the temperature-compensated time, analogous to the creep behavior of alpha solid solutions.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1952
Accession Number
AD0000691

Entities

People

  • John E. Dorn
  • Oleg D. Sherby
  • Warren H. Giedt

Organizations

  • University of California, Berkeley

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Alloys
  • Aluminum
  • Aluminum Alloys
  • Chemical Analysis
  • Copper Alloys
  • Creep
  • Creep Tests
  • Grain Size
  • Heat Of Activation
  • Heat Treatment
  • High Temperature
  • Materials
  • Mean Free Path
  • Metals
  • Solid Solutions
  • Tensile Properties
  • Tensile Strength

Fields of Study

  • Materials science

Readers

  • Analytical Mechanics
  • Powder metallurgy of Titanium alloys.