LOWER COST PACKAGING FOR GUIDED MISSILE ELECTRONICS

Abstract

A study was made of packaging techniques for guided missile electronics in which it was pointed out that the real cost of such electronic devices is not that cost required to manufacture the end product, but that cost which includes its share of the financial burden of development and production. It was shown that the over-all costs could be reduced by shortening development programs through the elimination of steps in the packaging process and by substantially reducing the effects of the environment so that less costly electronic components can be utilized. The method is dependent upon the use of (1) mounting materials with certain specific qualities to insure optimum performance of packages in several simultaneous environmental situations and, if necessary, (2) cooling fluids compatible with anticipated heat inputs and stated engineering boundaries.

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Document Details

Document Type
Technical Report
Publication Date
Mar 28, 1961
Accession Number
AD0255658

Entities

People

  • Kenneth E. Woodward

Organizations

  • Harry Diamond Laboratories

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Dynamic Loads
  • Dynamic Response
  • Electron Tubes
  • Electronic Components
  • Electronic Equipment
  • Electronics
  • Engineering
  • Guided Missiles
  • Materials
  • Military Research
  • Munitions
  • Ordnance Laboratories
  • Resonant Frequency
  • Standing Waves
  • Test Equipment
  • Test Facilities
  • Vibration

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Life Cycle Cost Analysis
  • Pulsed Power and Plasma Physics.

Technology Areas

  • Microelectronics