COMMON PARALLEL THERMOCOUPLES FOR AVERAGE TEMPERATURE MEASUREMENT

Abstract

The report describes the use of common parallel thermocouple circuits for temperature control in thermal simulation. Iron-constantan thermocouples were welded directly to the basic metal being heated. Structural tests at elevated temperatures show that thermocouples connected into parallel electrical circuits and grounded to a common metal sheet give the same temperature measurements as separated thermocouples connected into a parallel circuit. This method is applicable to any test situation requiring average temperatures.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1960
Accession Number
AD0255753

Entities

People

  • Bernard C. Boggs

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Circuits
  • Climate Change
  • Electrical Circuits
  • Engineering
  • Equations
  • Heat Energy
  • Materials
  • Measurement
  • Measuring Instruments
  • Metal Plates
  • Metals
  • Plastic Explosives
  • Simulations
  • Switching
  • Switching Circuits
  • Temperature Gradients

Fields of Study

  • Physics

Readers

  • Parallel and Distributed Computing.
  • Thermal Physics or Thermal Science.