MAXIMUM PACKING DENSITY OF NON-REDUNDANT SEMICONDUCTOR DEVICES
Abstract
IT IS SHOWN THAT THERE EXISTS AN ABSOLUTE UPPER LIMIT TO PACKING DENSITY OF NON-REDUNDANT SEMICONDUCTOR DEVICES, WHETHER INTEGRATED OR NONINTEGRATED, BASED ON FUNDAMENTAL PHYSICAL PHENOMENA SUCH AS STATISTICAL VARIATIONS IN IMPURITY DISTRIBUTION, MAXIMUM RESOLUTION OF SEMICONDUCTOR FABRICATION METHODS, POWER DENSITY AND INFLUENCE OF COSMIC RAYS. The influence of these phenomena falls into 2 categories, namely, failures that appear during the fabrication of the devices (impurity distribution, dividing operation) and failures that appear during use. The latter may be temporary failures (cosmic ray ionization, carrier fluctuations) or permanent failures (atomic displacements by cosmic rays, heat generation). (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 31, 1961
- Accession Number
- AD0258200
Entities
People
- J.t. Wallmark
- S.m. Marcus
Organizations
- Sarnoff Corporation