DEVELOPMENT OF ULTRA HIGH TEMPERATURE DIELECTRIC MATERIALS FOR EMBEDDING AND ENCAPSULATING ELECTRONIC COMPONENTS

Abstract

INCREASING THE CONCENTRATION OF AQUEOUS ALUMINUM PHOSPHATE DECREASED THE POROSITY OF PHOSPHATEBONDED SYNTHETIC MICA COMPOUND. Porosity can be decreased by glass coatings but the thermal expansion of the glass must match that of the sample. A volume shrinkage of approximately 7% was calculated for a standard phosphate-bonded synthetic mica compound. Initial results of electrical properties at elevated temperatures indicate that the phosphate-bonded synthetic mica systems are suitable for 500 C use. Commercial electronic components (magnetic amplifiers, capacitors, and small motors) were successfully potted and encapsulated with the bonded synthetic mica compound. (Author)

Document Details

Document Type
Technical Report
Publication Date
Nov 16, 1960
Accession Number
AD0258395

Entities

People

  • F.a. Barr
  • J.p. Mccarthy

Tags

DTIC Thesaurus Topics

  • Amplifiers
  • Capacitors
  • Dielectrics
  • Electrical Properties
  • Electronic Components
  • High Temperature
  • Magnetic Amplifiers
  • Materials
  • Porosity
  • Thermal Expansion

Readers

  • Reinforced Composite Materials
  • Surface Engineering/Surface Coating Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems