DEVELOPMENT OF RESISTOR MICROELEMENTS
Abstract
Results are presented of the task to produce precision resistors in the micro-module form factor. The over-all micro-module objectives of reliability, miniaturization, suitability for automatic processing, and a component density of 600,000 parts per cubic foot were the requirements. An investigation was made of possible substrate materials for resistors. The strength, thermal conductivity, thermal expansion, moisture resistance, surface cond tion and electrical resistivity of various materials were investigated. Alumina was selected and alumina wafers were produced by dry pressing or by slicing and grooving of ceramic bars. In the area of terminations, many microelements were excessively thick due to solder buildup. This problem was solved by reducing the temperature of the solder pot into which these elements were dipped for tinning. The elements were then removed from the solder pot slowly so that the excess solder was wiped off the elements by the surface tension of the solder. It was found that a protective coating applied to the resistors during the last step in manufacture changed the resistance values slightly. The sequence of the process was changed so that the final testing followed the application of the coating. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 17, 1958
- Accession Number
- AD0260053