DEVELOPMENT PROGRAM FOR MODULAR INTERCONNECTIONS FOR MICRO-ASSEMBLIES

Abstract

The development of a tec nique for fabricating reliable, welded, electronic micro-assembly connections with a termination density up to 1600 junctions per square inch resulted in electron beam welding sing the HamiltonZeiss electron beam machine. This is a statistically predictable, exceptionally reliable joining process. The process has a capability of fabricating 1600 terminations per square inch in a system configuration required in the Signal Corps Micro Module Program. (Author)

Document Details

Document Type
Technical Report
Publication Date
Apr 30, 1961
Accession Number
AD0260992

Entities

People

  • Robert H. Homstead

Organizations

  • United Technologies Corporation

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Assembly
  • Electron Beam Welding
  • Electron Beams
  • Electrons
  • Joining
  • Welding

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Metallurgy
  • Snow Cover Descriptors for Reptiles and Their Illustrations.

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Microelectromechanical Systems