ULTRASONIC GRINDING TECHNIQUES IN MICROMINIATURIZATION

Abstract

Ultrasonic impact grinding techniques are shown to be extremely useful in the fabrication of microcircuit substrates and other specialty component parts. Pertinent parameters of machine operation and tool design are discussed and detailed examples of applications are given. These include the fabrication of (1) sections of glass only 0.005 in. in thickness, (2) multihole substrates, (3) Hall measurement specimens, (4) tiny toroids, and (5) spiral grooves.

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Document Details

Document Type
Technical Report
Publication Date
Jul 28, 1961
Accession Number
AD0261593

Entities

People

  • John Krawczyk

Organizations

  • Harry Diamond Laboratories

Tags

Communities of Interest

  • Advanced Electronics
  • Counter WMD
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Ceramic Materials
  • Chemistry
  • Control Knobs
  • Electronics
  • Engineering
  • Fabrication
  • Frequency
  • Materials
  • Measurement
  • Microcircuits
  • Military Research
  • Munitions
  • Nuclear Radiation
  • Solid State Electronics
  • Stainless Steel
  • Thickness

Readers

  • Integrated Circuit Design and Technology.
  • Metallurgy
  • Plasma Physics / Magnetohydrodynamics

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems