MICROMINIATURIZED PACKAGING OF 2N384 AND 2N697

Abstract

Research was continued on the microminiaturized packaging of transistors. Processes and designs were successfully demonstrated for mounting a 2N384 type transistor on an 0.250 inch O.D. hermetic package. Technical problems restricting shock performance for this device were solved. Attempts to use epitaxial devices in the development models of the 2N696-7 device disclosed difficulties. The manufacture of development models with non-epitaxial dice has started.

Document Details

Document Type
Technical Report
Publication Date
Jun 30, 1961
Accession Number
AD0261736

Entities

People

  • C. Lawrenson
  • J. Mcmanus
  • L. Epstein

Organizations

  • Sylvania Electric Products

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Active Electronic Components
  • Electronic Components
  • Electronic Equipment
  • Electronics
  • Packaging
  • Transistors

Readers

  • Adaptive Control and Estimation with Uncertainty in Dynamic Systems.
  • Integrated Circuit Design and Technology.
  • Thermal Physics or Thermal Science.