CERAMIC I-F TRANSFORMERS

Abstract

An improved package for miniature radial resonators and filters in the 1.5 to 5 mc range utilizes a slot design in the micro-module configuration. Slot compartments for the resonators and all electrical interconnections are contained on or within the micro-module body wafer. The resonators can then be inserted and the assembly tested before the cover plates are attached. Three and five element filter sections, as well as single resonators, were satisfactorily packaged in this manner. The contribution of fringing electric fields to the range of action for dot electrodes on a ceramic wafer was determined graphically. The application of photoetching techniques to obtain electrode configurations on ceramic wafers was investigated for electroless nickel, copper, and silver films. Of these, the most desirable appears to be electroless copper, which has adequate adhesion and yields sharp well defined photo-etched images. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 11, 1961
Accession Number
AD0262220

Entities

People

  • D.j. Koneval
  • Damian Curran

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Assembly
  • Electric Fields
  • Electrodes
  • Photoengraving
  • Resonators
  • Transformers

Readers

  • Microwave Engineering.
  • Software Engineering
  • Surface Engineering/Surface Coating Technology.