PRODUCTION ENGINEERING MEASURES. DIFFUSED SEMICONDUCTOR DEVICES 7, 12 PLUS 2N559 AND 2N1094

Abstract

Mechanization of Device 12 -- The automatic wafer bonding, automatic wire bonding and dc and HF test machines were developed and used to produce the pilot units. Mechanization of 2N5592N1094 -- The Header Continuous Rack Plating, Emitter Etching and 2N559 Testing and Packaging machines were completed. The Header Assembling Machine was operated and the results indicated that the machine could be used for limited assembly of product. The 4 machines which are in various stages of construction are Universal Cleaning and Plating, Can Assembly, Testing and Packaging - 2N1094 and Data Handling. The Universal Cleaning and Plating machine module which was used as a guide was satisfactorily proved-in. The design phase of the Can Assembly machine was completed and construction was started. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 10, 1961
Accession Number
AD0262381

Entities

People

  • B.w. Shugars

Tags

DTIC Thesaurus Topics

  • Assembly
  • Automatic
  • Compound Semiconductors
  • Construction
  • Electronics
  • Engineering
  • Manufacturing
  • Mass Production
  • Mechanization
  • Packaging
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Semiconductor Devices
  • Semiconductors

Fields of Study

  • Engineering

Readers

  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems