INDUSTRIAL PREPAREDNESS STUDY. 2N667 AND 2N668 RUGGEDIZED AUDIO TRANSISTORS

Abstract

The completion is reported of the pilot run devices. Improved constraint and additional controls at alloying produced improvements in diode characteristics. The manufacturing interval required for assembly was reduced, providing more rapid feedback of process information. Modification of the electrical post-etch testing and closer control of the surface treatment and encapsulation processes resulted in the elimination of the unstable, anomalous characteristics experienced previously. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 31, 1961
Accession Number
AD0262382

Entities

People

  • G.t. Demoss
  • L.d. Jr. Emery

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Assembly
  • Elimination
  • Encapsulation
  • Feedback
  • Industrial Preparedness
  • Intervals
  • Manufacturing
  • Mass Production
  • Surface Finishing
  • Transistors

Readers

  • Materials Science and Engineering.
  • Software Engineering