INVESTIGATIONS OF ELECTRON DEVICE MATERIALS TECHNOLOGY STUDIES OF BRAZING AND METAL-JOINING PROBLEMS

Abstract

Studies were made of the effect of diffusion on brazed joints in electron tubes and exposed to relatively high temperatures. Mo was chosen as the base metal because it is used in locations where it will be subjected to elevated temperatures. Brazes were made with an Au-Ni filler. The brazed assemblies were heat-treated at different temperatures for 7 and 21 hours. Because of diffusion, an intermetallic compound of Au-NiMo was formed. The room-temperature strength of the joints with large amounts of this compound was considerably lower than that of joints without it. An additional study was made of a joint in which the brazing filler was in solution in the Mo base metal. By keeping the brazed assembly slightly above the eutectic temperature for about 5 hr, joints were made that had Ni completely in solution in some areas and that were not susceptible to the formation of intermetallic compounds. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1961
Accession Number
AD0264459

Entities

People

  • Lester Feinstein

Organizations

  • SRI International

Tags

DTIC Thesaurus Topics

  • Assembly
  • Base Metal
  • Brazed Joints
  • Brazing
  • Diffusion
  • Electron Tubes
  • Electrons
  • High Temperature
  • Intermetallic Compounds
  • Joining
  • Joints
  • Materials
  • Metals

Readers

  • Materials Science and Engineering.
  • Metallurgy
  • Powder metallurgy of Titanium alloys.

Technology Areas

  • Microelectronics