DEVELOPMENT OF ULTRA HIGH TEMPERATURE DIELECTRIC MATERIALS FOR EMBEDDING AND ENCAPSULATING ELECTRONIC COMPONENTS

Abstract

Phosphate synthetic mica was investigated as a dielectric material for encapsulating and embedding electronic components for 500 C use. Physical properties of the system were determined and found to be suitable for high temperature use. Various methods of reducing porosity were investigated including dry pressing, glass coating, additives and various phosphate bonds. The use of a devitrified glass sealing cement as a coating for the phosphate synthetic mica resulted in a composite material cured below 500 C, having good physical properties with water absorption less than 1%. Commerical capacitors, transformers, and motors were encapsulated and tested. Prototype high temperature resistors were constructed and encapsulated for 500 C applications using ceramo-plastic injection molding techniques in combination with the phosphate-mica dielectric material. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 16, 1961
Accession Number
AD0265499

Entities

People

  • F.a. Barr
  • J.p. Mccarthy

Tags

DTIC Thesaurus Topics

  • Composite Materials
  • Dielectrics
  • Electronic Components
  • High Temperature
  • Injection Molding
  • Materials
  • Materials Processing
  • Molding Techniques
  • Physical Properties

Fields of Study

  • Materials science

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics