METHOD OF MANUFACTURING PRINTED CIRCUITS
Abstract
Printed circuits manufactured by the known method of pressing a copper powder, which is applied as an even layer onto a base with a thermoadhesive coating, by a heated relief matrix still have a sufficiently large resistance due to the low compactness of the printed conductors. A method is described which makes it possible to eliminate this shortcoming of the existing method. A greater structural compactness of the printed conductors and smaller resistance of the latter is achieved by adding from 5 to 25% by weight (mainly 10-12%) tin powder to the copper powder. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 06, 1961
- Accession Number
- AD0265698
Entities
People
- G.m. Belevich
- I.i. Yefimenko
Organizations
- National Air and Space Intelligence Center