ENCAPSULATING, POTTING, AND EMBEDDING MATERIALS FOR ELECTRONIC COMPONENTS AND MODULES. AN ANNOTATED BIBLIOGRAPHY

Abstract

This bibliography results from a search for information on materials used for encapsulating, potting, and embedding electronic components. There are 97 references, arranged by title, with publication dates between January 1958 and August 1961. Following the references are indexes of authors and sponsors, journal sources, and report numbers. The following sources were consulted during the search: LMSC Technical Information Center card catalogs, Applied Science and Technology Index, 1958-1961, ASTIA Technical Abstract Bulletin, 1958-1961, Electrical Engineering Abstracts, 1958-1961, Engineering Index, 1958-1961, U.S. Government Research Reports, 1960-1961, and Pertinent journals, 1961. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1961
Accession Number
AD0265866

Entities

People

  • George E. Owens

Organizations

  • Lockheed Martin Missiles and Space

Tags

DTIC Thesaurus Topics

  • Abstracts
  • Bibliographies
  • Electrical Engineering
  • Electronic Components
  • Embedding
  • Engineering
  • Materials
  • Technical Information Centers

Readers

  • Library and Information Science
  • Nanocomposite Materials Science

Technology Areas

  • Microelectronics