GRAIN BOUNDARY CRACKING IN METALS UNDER STRESS AT ELEVATED TEMPERATURES

Abstract

A study was made of the effect of purification and of a number of metal and oxide additions upon the occurrence of intergranular cracking in brass, Cu, Ni, Ti and Zr under t nsion at elevated temperatur s. Purificatio by a variety of means inhibited in ergranular cracking in brass, Cu, and Ni. Zr additions also decreased the frequency of grain boundary cracks in brass and Cu, while Al2O3 additions increased the number of cracks. Under a wide variety of conditions, Ti and Zr of commercial purity were immune to grain boundary cracks and intergranular fracture. A few experiments re performed to demonstrate t e parallel effect of impurities and additions upon the nucleation of voids during diffusion; the initiation of grain boundary cracks during creep; the mechanism of crack nucleation by vacancy condensation is discussed (Aut or)

Document Details

Document Type
Technical Report
Publication Date
Jun 15, 1961
Accession Number
AD0266025

Entities

People

  • Jack Brett

Tags

DTIC Thesaurus Topics

  • Boundaries
  • Condensation
  • Critical Temperature
  • Diffusion
  • Frequency
  • Glass Transition Temperature
  • Grain Boundaries
  • Impurities
  • Nucleation
  • Transition Temperature

Readers

  • Materials Science and Engineering.
  • Structural Health Monitoring of Composite Structures.
  • Surface Engineering/Surface Coating Technology.