PRODUCTION ENGINEERING MEASURES. DIFFUSED SEMI-CONDUCTOR DEVICES 7, 12 PLUS 2N559 AND 2N1094

Abstract

RESEARCH WAS CONTINUED ON THE PRODUCTION OF DIFFUSED SEMICONDUCTOR DEVICES. The can punching machine, the wafer to header bonding machine and a second strip perforating and welding machine were completed. All prove-in details of the 2N559 Testing and Packaging Machine were completed. Design was completed, but construction was delayed to determine if a similar machine, being built for another code, can perform the coating operation. The wafer screening machine, the gold wire handling and bonding machine and the holder loader remained in the prove-in phase. Five machines, in addition to the coating and second gold wire handling and bonding machines, are in various stages of design and/or build. Their status is summarized. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1961
Accession Number
AD0266853

Entities

People

  • M.n. Reppert

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Compound Semiconductors
  • Construction
  • Electronics
  • Engineering
  • Machines
  • Packaging
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Punching Machines
  • Semiconductor Devices
  • Semiconductors
  • Solid State Electronics

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems