MODULAR INTERCONNECTIONS FOR MICRO-ASSEMBLIES. PHASE II
Abstract
Research concerns the establishment of interconnecting systems to effect the integration of electronic parts into reliable equipment of minimum possible size. Efforts are divided into 2 tasks: Task A calls for the development of a reliable type of electron beam welded microassembly consisting of glass or alumina substrates stacked vertically and interconnected by conductor ribbons with a termination density of 1600 terminations per square inch on each side of the four sides of a micro-assembly. Task C calls for a study of the feasibility of cutting discrete terminals on the edge and faces of a substrate. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 30, 1961
- Accession Number
- AD0267413
Entities
People
- Robert H. Homstead