The Production of Thin Copper Single Crystals. A Feasibility Study.
Abstract
A method was developed for producing a stack of Cu single crystal disks 50-microns thick which utilized the spar planning technique followed by chemical polishing. The method for processing 35- to 50-micron thick disks is as follows: (1) grow 2.5-mm thick slabs as big as possble, (2) spark-tepan 1-cm diam dics and spark plane to 75 to 100 microns thick, and (3) chemically thin to 35 to 50 microns. Attempts to grow single crystal Cd disks resulted in the formation of polycrystalline sheets.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1961
- Accession Number
- AD0267806