STATUS OF MICROMINIATURIZATION - JUNE 1961
Abstract
The status of microminiaturization is summarized under three headings: (1) assembly of pretested conventional or specially designed component parts, (2) printing or vapor deposition of multi-component assemblies on flat insulating substrates, and (3) preparation of complete circuits from a solid block of semiconductor material. Under the first heading, new developments include imitation 2D-type structures, and pelletized parts. Under the second heading, the evolution of the 2D thin-film type of construction into experimental circuits containing all thin-film passive parts is shown. The logical next step, preparation of circuits containing thin-film active as well as passive parts, is discussed. Under the third heading, new developments in integrated and functional circuits are presented. The trend of current work points to the conclusion that equipment available commercially in the next decade will probably take the form of hybrid structures comprising both individually fabricated parts, and single-process parts arrays, all mounted or processed onto an insulating substrate.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1961
- Accession Number
- AD0268080
Entities
People
- Eleanor F. Horsey
- Philip J. Franklin
Organizations
- Harry Diamond Laboratories