EFFECT OF BASIC PHYSICAL PARAMETERS ON ENGINEERING PROPERTIES OF INTERMETALLIC COMPOUNDS

Abstract

The tensile behavior of the CsCl structure compound AgMg are extensively documented in terms of strain, strain rate, temperature, grain size, composition, and metallurgical processing treatment. Three regimes of deformation behavior are observed: low temperatures, i termedi te teperatures, a d high temperatures. In each of these regimes different deformation processes operated. Exploratory studies on other intermetallics are reported. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1961
Accession Number
AD0268912

Entities

People

  • D.l. Wood
  • J.h. Westbrook

Organizations

  • General Electric

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Engineering
  • Grain Size
  • High Temperature
  • Intermetallic Compounds
  • Low Temperature
  • Strain Rate

Fields of Study

  • Materials science

Readers

  • Marine Propulsion Engineering and Naval Architecture
  • Materials Science and Engineering.