TUNGSTEN TO GRAPHITE BONDING

Abstract

The reactions of various metallic carbides with W and with graphite were studied for the purpose of developing a W to graphite bond system for use at temperatures up to 5000 F. A bond composition and process was developed that yielded good bonds; however, the desired reproducibility was not achieved. The bond composition developed also formed an excellent coating for graphite, having good thermal shock resistance and adherence at temperatures up to at least 5000 F. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 13, 1961
Accession Number
AD0270115

Entities

People

  • J.b. Northrup
  • J.r. Armstrong
  • Roger A. Long

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Bonding
  • Graphitic Materials
  • Joining
  • Reproducibility
  • Resistance
  • Shock
  • Shock Resistance
  • Thermal Shock
  • Tungsten

Readers

  • Surface Engineering/Surface Coating Technology.