MECHANIZATION OF SEMICONDUCTOR DEVICES 2N560, 2N1051, 2N1195, 1N664, 1N665, 1N666, 1N667, 1N668, 1N669, 1N673, 1N675, 1N697 AND 1N701

Abstract

Contents: Transistors: Cleaning header lead wire; collector lead to platform welding; header assembling; wafering; wafer loading; wafer screening; wafer to header bonding; wire bonding; emitter etching; can-getter assembly; can to header closure weld; painting and coating; coding; dc and switch testing; packing; data collection test set; wafer screening and electrical probe testing; special test set; electrical testing. Diodes: Wafer preparation; wafer evaluation; stud lead cleaning; gold bonding; etching, oxidizing, cleaning and drying; assemble case to stud and welding; lead straightening and racking; Low temperature reverse current and shock testing; gold plating; coding; coating; electrical testing; packaging; data producing test set.

Document Details

Document Type
Technical Report
Publication Date
Sep 26, 1961
Accession Number
AD0270546

Entities

People

  • M.n. Reppert

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accumulators
  • Assembly
  • Compound Semiconductors
  • Electronic Equipment
  • Electronics
  • Lead Wires
  • Low Temperature
  • Mechanization
  • Packaging
  • Platforms
  • Semiconductor Devices
  • Semiconductors
  • Solid State Electronics
  • Test Sets
  • Transistors
  • Wire

Fields of Study

  • Materials science

Readers

  • Semiconductor Device Technology
  • Software Engineering
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems