SEMICONDUCTOR RESISTIVE ELEMENT
Abstract
Efforts were made to develop a low temperature coefficient of resistance (TCR) semiconductor resistive element with more stable characteristics and greater reliability than the metal film resistors presently on the market. Several semiconductor materials (reduced ttania, silicon carbide, silicon boride, gallium arsenide, etc.) were considered as bulk elements and for various reasons were rejected. The elements thought most promising were silicon layer configurations formed either by diffusion or by vapor deposition. Silicon layer elements in the preliminary stages of development exhibited TCR's as low as 350 ppm at resistivities of approximately 0.0X ohm-cm. Load life and TCR data are presented for both the standard network devices and the experimental silicon diffused, epitaxial and polycrystalline elements. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1962
- Accession Number
- AD0271050
Entities
Organizations
- Texas Instruments