STUDIES AND SURVEYS IN THE FIELD OF PRINTED CIRCUIT BOARDS AND FOIL CLAD LAMINATES

Abstract

Results of a study covering 5 areas of interest in the evaluation of foil clad laminates used for the manufacture of printed wiring boards are reported. This study covers the design and construction of necessary testing equipment, the establishment of testing procedures, and the gathering of experimental data to provide more complete information for specification requirements for these materials. This report is divided into 5 areas of discussion as follows: Allowable limits per square for nicks, pin holes and scratches on printed wiring boards; Study of insulation resistance on foil clad laminates; Peel strength after dip solder; Peel strength at elevated temperatures; and a complete evaluation of copper clad paper base epoxy laminates. Specimen preparation, testing methods, an analysis of experimental data, and where appropriate, recommended specification provisions are presented under each task. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jun 30, 1961
Accession Number
AD0272608

Entities

People

  • John Jackman

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accuracy
  • Circuit Boards
  • Electrical Circuits
  • Epoxy Laminates
  • Fabrication
  • Laminates
  • Materials Laboratories
  • Materials Processing
  • Materials Testing
  • Measurement
  • Physical Properties
  • Plastic Explosives
  • Printed Circuit Boards
  • Printed Circuits
  • Resins
  • Test And Evaluation
  • Test Methods

Fields of Study

  • Materials science

Readers

  • Integrated Circuit Design and Technology.
  • Surface Coatings Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics